Solder joint reliability of plastic ball grid array with solder bumped flip chip
نویسندگان
چکیده
منابع مشابه
Nonlinear Analysis of Plastic Ball Grid Array Solder Joints
(2001) Nonlinear analysis of plastic ball grid array solder joints. Notice: Changes introduced as a result of publishing processes such as copy-editing and formatting may not be reflected in this document. For a definitive version of this work, please refer to the published source: ABSTRACT A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder...
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An investigation on the solder bumped Flip Chip on Printed Circuit Board (FCOB) is presented in this paper. The emphasis is placed on the effects of delamination crack between the underfill encapsulant and the solder mask on the solder joint reliability of FCOB. In the present study, a fracture mechanics approach is employed. The strain energy release rate at the crack tip between the underfill...
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In order to successfully implement reliable Flip Chip packaging technology, it is desirable to ensure solder fatigue as the limiting mechanical failure mechanism. Doing so enables the packaging engineer to design to specific reliability standards, as solder fatigue is a known and predictable failure mechanism. Indeed, other Flip Chip failure modes such as silicon fracture and underfill delamina...
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ژورنال
عنوان ژورنال: Soldering & Surface Mount Technology
سال: 2000
ISSN: 0954-0911
DOI: 10.1108/09540910010312401